Anti-Counterfeiting Testing Services

Sourcing
Avoidance is the first step of counterfeit-part risk mitigation. ICHERO’s suppliers are formally selected, qualified, and continually evaluated to ensure their ability to provide product that meets customer requirements, in line with CCAP-101 and AS6081 certification standards.

Visual Inspection
ICHERO’s CCCI-102 Level 1 and Level 2 quality inspectors meticulously examine components to verify that part dimensions, markings, leads, packaging, and other characteristics are consistent with manufacturer specifications.

Digital Microscopy
ICHERO’s stereo and high-powered microscopes can magnify up to 500x to detect blacktopping, sanding, oxidation, and retinning.

Digital Imagery
Our high-definition microscopes can reproduce views as 60x HD images, allowing us to inspect components with unsurpassed color rendition and no distortion, delay, or interference.

Dimensional Measurement
With an integrated 2D/3D measurement system and extremely high depth of field, ICHERO’s high-magnification HD/3D microscope can capture any area in complete focus.

Nondestructive Testing
Nondestructive testing includes a variety of testing and inspection techniques that are proven to be nondestructive to a component’s performance or reliability. These methods are used to identify markings, voids, and other anomalies in or on components.

X-Ray
X-ray images are compared against OEM parts and are also used to verify that no voids have formed and to confirm leads and bond wires.

XRF
ICHERO’s XRF machine measures coating systems to determine coating thickness and composition and analyzes material content for small structures and small components.

C-SAM
C-SAM acoustic microscopy uses pulse-echo imaging to detect voids, cracks, and delaminations and penetrate blacktopping to expose markings.

Curve Tracer
ICHERO’s curve tracer performs reliability analysis, verifies pins and electrical continuity, and analyzes anomalous characteristics.

Destructive Testing
Destructive testing is the final component of ICHERO’s authenticity-testing process. More invasive measures, such as decapsulation and lead solderability, may be required in some instances to confirm the legitimacy of a product.

Decapsulation
Decapsulation is used to verify die size and manufacturers’ logos, inspect the architecture of the die, and confirm part numbers.

Heated Solvent
Heated-solvent testing exposes signs of counterfeiting by detecting sand marks, texture differences, and blacktopping.