Introduction
Counterfeit electronic components have become a major pain point in the component industry. In response to the prominent problems of poor batch-to-batch consistency and widespread counterfeit components, this testing center provides destructive physical analysis (DPA), identification of genuine and fake components, application-level analysis, and component failure analysis to evaluate the quality of components, eliminate unqualified components, select high-reliability components, and strictly control the quality of components.
Electronic component testing items
01 Destructive Physical Analysis (DPA)
Overview of DPA Analysis:
DPA analysis (Destructive Physical Analysis) is a series of non-destructive and destructive physical tests and analysis methods used to verify whether the design, structure, materials, and manufacturing quality of electronic components meet the specification requirements for their intended use. Suitable samples are randomly selected from the finished product batch of electronic components for analysis.
Objectives of DPA Testing:
Prevent failure and avoid installing components with obvious or potential defects.
Determine the deviations and process defects of the component manufacturer in the design and manufacturing process.
Provide batch processing recommendations and improvement measures.
Inspect and verify the quality of the supplied components (partial testing of authenticity, renovation, reliability, etc.)
Applicable objects of DPA:
Components (chip inductors, resistors, LTCC components, chip capacitors, relays, switches, connectors, etc.)
Discrete devices (diodes, transistors, MOSFETs, etc.)
Microwave devices
Integrated chips
Significance of DPA for component procurement and replacement evaluation:
Evaluate the components from the internal structural and process perspectives to ensure their reliability.
Physically avoid the use of renovated or counterfeit components.
DPA analysis projects and methods: Actual application diagram
02 Genuine and Fake Component Identification Testing
Identification of Genuine and Fake Components (including renovation):
Combining DPA analysis methods (partially), the physical and chemical analysis of the component is used to determine the problems of counterfeit and renovation.
Main objects:
Components (capacitors, resistors, inductors, etc.)
Discrete devices (diodes, transistors, MOSFETs, etc.)
Integrated chips
Testing methods:
DPA (partially)
Solvent test
Functional test
Comprehensive judgment is made by combining three testing methods.
03 Application-level Component Testing
Application-level analysis:
Engineering application analysis is conducted on components with no issues of authenticity and renovation, mainly focusing on the analysis of the heat resistance (layering) and solderability of the components.
Main objects:
All components
Testing methods:
Based on DPA, counterfeit and renovation verification, it mainly involves the following two tests:
Component reflow test (lead-free reflow conditions) + C-SAM
Component solderability test:
Wetting balance method, small solder pot immersion method, reflow method
04 Component Failure Analysis
Electronic component failure refers to the complete or partial loss of function, parameter drift, or intermittent occurrence of the following situations:
Bathtub curve: It refers to the change of the reliability of the product during its entire life cycle from start to failure. If the failure rate of the product is taken as the characteristic value of its reliability, it is a curve with the use time as the abscissa and the failure rate as the ordinate. Because the curve is high on both ends and low in the middle, it is somewhat like a bathtub, hence the name "bathtub curve."
Post time: Mar-06-2023